期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (8)
The electromagnetic interference (EMI) problems are crucial for system-in-package (SiP) due to the high demand of miniaturization and dense integratio......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (6)
A photovoltaic-thermoelectric (PV-TE) hybrid system can be used for efficient thermal energy utilization from the generated waste heat in PV devices. ......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (6)
This article presents a flexible implantable device fabricated on a polyimide (PI) catheter for targeted treatment of cardiovascular diseases. The cop......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (6)
A +/- 45 degrees polarization diversity dipoles' antenna is designed and fabricated by 3-D printing technology in combination with mussel-inspired sur......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (6)
This study experimentally investigated the whole-life ratcheting behavior of sintered copper joints with consideration of the effects of stress rate, ......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (5)
The ball grid array (BGA) is a type of popular and competitive package in electronic flip-chip packaging due to its feasibility in high density integr......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (9)
With a short product cycle as we see today, fast and accurate modeling methods are becoming crucial for the development of new generation of electroni......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (9)
Heat dissipation of the fan-out (FO) package is a primary concern in advanced electronic packaging. It is a challenge to characterize the thermal perf......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (7)
Solder interconnects are essential to the reliability of electronic devices. The addition of alloying elements was reported to provide beneficial effe......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (5)
Based on electric-current-assisted sintering (ECAS) of silver paste, we propose a novel hermetic sealing method for the metal package. The monitoring ......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (6)
An ultrasonic testing method was used to detect the fretting wear behavior of electrical connectors. The specimens used in this study were contacts of......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (5)
The through-silicon via (TSV) technology is widely used in 3-D integrated circuit (3-D IC) devices. However, the TSV could cause great thermal stress ......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (7)
The rapid growth of the advanced consumer 5G wireless mobile phones has propelled the demands of fabricating surface acoustic wave (SAW) filters with ......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (7)
A cost-effective ball grid array (BGA) packaged surface-mount off-center-fed dipole antenna element and its array are proposed for 5G millimeter-wave ......
期刊： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021; 11 (4)
As a major component of electrical wiring interconnection systems (EWISs), aircraft electrical connectors are used for the transmission of electrical ......
